出品公司: | ATCC |
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菌种名称: | ATCC 28321, ATCC28321 |
菌种又名: | LKB-335 [CBS 6701, IFO 1669, NRRL Y-7904, NRRL Y-7952] |
菌株类型: | Yamadazyma akitaensis |
存储人: | K Kodama |
分离来源: | Exudate of Salix sp., Japan |
产品目录号: | 28321 |
其他保藏库编号: | BCRC22680,ATCC 28321 ;CBS 6701 ;IFO 1669 ;NRRL Y-7904 ;NRRL Y-7952 |
培养基: |
ATCC®培养基28:Emmons对Sabouraud琼脂的改性
ATCC®培养基200:YM琼脂或YM肉汤
ATCC®培养基1245:Yepd
|
生长条件: | 24-26 ℃, 有氧 |
生物安全等级: | 1 |
模式菌株: | 是 |
应用: |
科研,生产,主要用于产生脂肪酶
在60°C条件下,在pH5.5、7.5和9.0下产生活性脂肪酶
|
菌株特点: |
ATCC 28321 是,Yamadazyma akitaensis。 |
参考文献: |
Groenewald M, Robert V, Smith MT. The value of the D1/D2 and internal transcribed spacers (ITS) domains for the identification of yeast species belonging to the genus Yamadazyma. Persoonia 26: 40-46, 2011. PubMed: 22025802
Kurtzman CP, Suzuki M. Phylogenetic analysis of ascomycete yeasts that form coenzyme Q-9 and the proposal of the new genera Babjeviella, Meyerozyma, Millerozyma, Priceomyces, and Scheffersomyces. Mycoscience 51: 2-14, 2010.
Villa-Carvajal M, Querol A, Belloch C. Identification of species in the genus Pichia by restriction of the internal transcribed spacers (ITS1 and ITS2) and the 5.8S ribosomal DNA gene: Identification of Pichia species by 5.8S-ITS rDNA RFLP. Antonie Van Leeuwenhoek 90: 171-181, 2006. PubMed: 16902755
Kurtzman CP, Robnett CJ. Identification and phylogeny of ascomycetous yeasts from analysis of nuclear large subunit (26S) ribosomal DNA partial sequences. Antonie van Leeuwenhoek 73(4): 331-371, 1998. PubMed: 9850420
Kurtzman CP, Robnett CJ. Identification of clinically important ascomycetous yeasts based on nucleotide divergence in the 5' end of the large-subunit (26S) ribosomal DNA gene. J Clin Microbiol 35: 1216-1223, 1997. PubMed: 9114410
Fukuhara H. Linear DNA plasmids of yeasts. FEMS Microbiol. Lett. 131: 1-9, 1995. PubMed: 7557303
Hou CT. pH dependence and thermostability of lipases from cultures from the ARS Culture Collection. J. Ind. Microbiol. 13: 242-248, 1994.
Kodama K. New species of Pichia isolated from tree exudates in Japan. J. Ferment. Technol. 53: 626-630, 1975.
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